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VS-VSKT26.. Datasheet(PDF) 3 Page - Vishay Siliconix |
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VS-VSKT26.. Datasheet(HTML) 3 Page - Vishay Siliconix |
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3 / 10 page ![]() VS-VSKT26.., VS-VSKH26.., VS-VSKL26.., VS-VSKN26.. Series www.vishay.com Vishay Semiconductors Revision: 26-Jul-2018 3 Document Number: 94629 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note • Table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC TRIGGERING PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum peak gate power PGM 10 W Maximum average gate power PG(AV) 2.5 Maximum peak gate current IGM 2.5 A Maximum peak negative gate voltage -VGM 10 V Maximum gate voltage required to trigger VGT TJ = -40 °C Anode supply = 6 V resistive load 4.0 TJ = 25 °C 2.5 TJ = 125 °C 1.7 Maximum gate current required to trigger IGT TJ = -40 °C Anode supply = 6 V resistive load 270 mA TJ = 25 °C 150 TJ = 125 °C 80 Maximum gate voltage that will not trigger VGD TJ = 125 °C, rated VDRM applied 0.25 V Maximum gate current that will not trigger IGD TJ = 125 °C, rated VDRM applied 6 mA BLOCKING PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum peak reverse and off-state leakage current at VRRM, VDRM IRRM, IDRM TJ = 125 °C, gate open circuit 15 mA Maximum RMS insulation voltage VINS 50 Hz 3000 (1 min) 3600 (1 s) V Maximum critical rate of rise of off-state voltage dV/dt TJ = 125 °C, linear to 0.67 VDRM 1000 V/μs THERMAL AND MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Junction operating and storage temperature range TJ, TStg -40 to +125 °C Maximum internal thermal resistance, junction to case per leg RthJC DC operation 0.76 °C/W Typical thermal resistance, case to heatsink per module RthCS Mounting surface flat, smooth and greased 0.1 Mounting torque ± 10 % to heatsink A mounting compound is recommended and the torque should be rechecked after a period of 3 hours to allow for the spread of the compound. 4 Nm busbar 3 Approximate weight 75 g 2.7 oz. Case style JEDEC® AAP Gen 7 (TO-240AA) R CONDUCTION PER JUNCTION DEVICES SINE HALF WAVE CONDUCTION RECTANGULAR WAVE CONDUCTION UNITS 180° 120° 90° 60° 30° 180° 120° 90° 60° 30° VSK.26.. 0.212 0.258 0.330 0.466 0.72 0.166 0.276 0.357 0.482 0.726 °C/W |
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