Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

F1129MB Datasheet(PDF) 4 Page - Renesas Technology Corp

Part # F1129MB
Description  50Ω SE-In – 100Ω DIFF-Out Amplifier 3.0GHz to 4.2GHz
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

F1129MB Datasheet(HTML) 4 Page - Renesas Technology Corp

  F1129MB Datasheet HTML 1Page - Renesas Technology Corp F1129MB Datasheet HTML 2Page - Renesas Technology Corp F1129MB Datasheet HTML 3Page - Renesas Technology Corp F1129MB Datasheet HTML 4Page - Renesas Technology Corp F1129MB Datasheet HTML 5Page - Renesas Technology Corp F1129MB Datasheet HTML 6Page - Renesas Technology Corp F1129MB Datasheet HTML 7Page - Renesas Technology Corp F1129MB Datasheet HTML 8Page - Renesas Technology Corp F1129MB Datasheet HTML 9Page - Renesas Technology Corp Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 22 page
background image
F1129MB Datasheet
© 2019 Renesas Electronics Corporation
4
January 31, 2021
Pin Assignments
Figure 2. F1129MB Pin Assignments for 2 × 2 × 0.75 mm 12-DFN Package – Top View
RF_OUT-
NC
RF_OUT+
EP
9
8
7
2
3
4
NC
NC
10
1
NC
RF_IN
NC
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1, 3, 4, 5, 7,
10
NC
No internal connection. It is highly recommended that these pins be connected to a ground via which is located
as close to each pin as possible.
2
RF_IN
Single ended RF Input. Must use external DC block.
6
STBY
Standby. If the pin is not connected or is logic LOW, the device will operate under its normal operating
condition. Apply a logic HIGH for STBY.
8
RF_OUT+
Differential RF Output +. Internally tied to ground. Recommended to use an external DC block to prevent
shorting of any DC voltage that may be present on the following RF stage.
9
RF_OUT-
Differential RF Output -. Internally tied to ground. Recommended to use an external DC block to prevent
shorting of any DC voltage that may be present on the following RF stage.
11
VCC_1
Connect to supply voltage via choke. An external bypass capacitor must be placed as close to the pin as
possible.
12
VCC_2
Connect to VCC. An external bypass capacitor must be placed as close to the pin as possible.
EPAD
Exposed paddle. Internally connected to ground. Solder this exposed paddle to a printed circuit board (PCB)
pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes.
These multiple ground vias are also required to achieve the specified RF performance.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com