F1129MB Datasheet

© 2019 Renesas Electronics Corporation

11

January 31, 2021

[a] Specifications in the minimum/maximum columns that are shown in bold italics are guaranteed by test. Specifications in these columns that

are not shown in bold italics are guaranteed by design characterization.

[b] Measures RF_IN to RF_OUT- and compares RF_IN to RF_OUT+ amplitude.

[c] Measures RF_IN to RF_OUT- and compares RF_IN to RF_OUT+ phase. Deviation is from ideal 180 degrees.

[d] Measures RF_IN to RF_OUT- and compares RF_IN to RF_OUT+.

Thermal Characteristics

Table 6.

Package Thermal Characteristics

Parameter

Symbol

Value

Units

Junction to Ambient Thermal Resistance.

112.57

°C/W

Junction to Case Thermal Resistance. (Case is defined as the exposed paddle)

27.6

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

Typical Operating Conditions (TOC)

Unless otherwise noted, for the TOC graphs on the following pages, the following conditions apply:



Evaluation kit connector and trace losses de-embedded







STBY = not connected (internally pulled logic LOW)







All unused ports properly terminated



parameters.





Amplitude and phase imbalances measures RF_IN to RF_OUT+ and compares to RF_IN to RF_OUT-



Phase imbalance is the deviation from an ideal 180 degrees

Note: The use of the external transformer T1 is included for simple 2 port evaluation purposes. At some frequencies the external transformer

interacts with the on-chip balun affecting the gain and noise figure flatness responses. These interactions have been removed from the

noise figure TOCs.