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L3751 Datasheet(PDF) 30 Page - STMicroelectronics |
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L3751 Datasheet(HTML) 30 Page - STMicroelectronics |
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30 / 41 page ![]() Figure 31. Board layout example Consequently, as anticipated at the beginning of the section, the external power component placing (Cin, Cboot, Cvcc, diode and both power elements) and wire connection to minimize inductive parasitic components is critical for the device operation and EMC reduction. Figure 31 shows an example of optimized board layout in terms of component placing and wire trace design that keep the mentioned critical loops on the layer 1, preventing PCB via insertion in critical high frequency loops. L3751 PCB board layout DS13841 - Rev 1 page 30/41 |
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