8MCJS505 datasheet(4/42 Pages) SOURIAU

4 / 42 page

microComp® Series

To respond to miniaturization and weight saving trends in aeronautical and defense

applications SOURIAU has developed an innovative high density connector range:

microComp® is the alternative to High Density (HD), D-Sub and micro-D.

• Very light: shell in composite (or aluminum). Up to 66% lighter than HD/D-Sub

• Very high density up to 40% smaller than HD D-Sub

• With crimp removable contacts for wire AWG 24 to 28

• Temperature up to 175°C

• High vibration and shock withstanding

• Standard MIL-STD 83513 accessories

• Compatible with high speed data rates (Gigabit Ethernet...)

For civil aviation, military aircraft, rotorcraft, UAV and military equipment:

• Radar

• Engine Control Unit

• Missiles & Weapon systems

• Flight test equipment

• Data acquisition equipment

• Cockpit equipment & Avionics

• In Flight Entertainment Systems

• Displays

• Infrared cameras

• Battery management system

... and any electronic device with space

and weight constraints

For space applications please consult our dedicated Space Grade microComp® catalog

Overview

Description

Applications

8MCJS505 Datasheet(PDF) 4 Page - SOURIAU-SUNBANK Connection Technologies