AP7375

Document number: DS44490 Rev. 3 - 2

11 of 18

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September 2022

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AP7375

Application Information

Output Capacitor

An output capacitor is required for the stability of the LDO. The recommended minimum output capacitance is 10

μF. A ceramic capacitor is

recommended, and temperature characteristics are X7R or X5R. Higher capacitance values help to improve load/line transient response. The

output capacitance may be increased to keep low undershoot/overshoot. Place output capacitor as close as possible to VOUT and GND pins.

Input Capacitor

A 1μF ceramic capacitor is recommended to connect between VIN and GND pins to decouple input power supply glitch and noise. The amount of

the capacitance may be increased without limit. This input capacitor must be located as close as possible to the device to assure input stability

and less noise. For PCB layout, a wide copper trace is required for both VIN and GND.

Current Limit and Short Circuit Protection

When output current at VOUT pin is higher than current-limit threshold or the VOUT pin is direct short to GND, the current-limit protection will be

triggered and clamp the output current at a pre-designed level to prevent overcurrent and thermal damage.

Thermal Protection

The AP7375 has internal thermal sense and protection circuits. When excessive power dissipation happens on the device, such as short circuit at

the output pin or very heavy load current with a large voltage drop across the device, the internal thermal protection circuit will be triggered, and it

will shut down the power MOSFET to prevent the LDO from damage. As soon as excessive thermal condition is removed and the temperature of

the device drops down, the thermal protection circuit will lease the control of the power MOSFET, and the LDO device goes to normal operation.

Layout Considerations

For good ground loop and stability, the input and output capacitors should be located close to the input, output, and ground pins of the device. The

regulator ground pin should be connected to the external circuit ground to reduce voltage drop caused by trace impedance. Ground plane is

generally used to reduce trace impedance. Wide trace should be used for large current paths from VIN to VOUT, and load circuit.