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LPC55S2X Datasheet(PDF) 4 Page - NXP Semiconductors |
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LPC55S2X Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 140 page ![]() LPC55S2x/LPC552x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2022. All rights reserved. Product data sheet Rev. 2.2 — 8 December 2022 4 of 139 NXP Semiconductors LPC55S2x/LPC552x 32-bit ARM Cortex-M33 microcontroller Analog peripherals: 16-bit ADC with five differential channel pair (or 10 single-ended channels), and with multiple internal and external trigger inputs and sample rates of up to 1.0 MSamples/sec. The ADC support simultaneous conversions, on 2 ADC input channels belonging to a differential pair. Integrated temperature sensor connected to the ADC. Comparator with five input pins and external or internal reference voltage. Clock generation: Internal Free Running Oscillator (FRO). This oscillator provides a selectable 96 MHz output, and a 12 MHz output (divided down from the selected higher frequency) that can be used as a system clock. The FRO is trimmed to +/- 2% accuracy over the entire voltage and -40 C to 105 C. For devices with date code 2041 (yyww)and onwards, the FRO is trimmed to +/- 1% accuracy over the entire voltage and 0 C to 85 C. 32 kHz Internal Free Running Oscillator FRO. The FRO is trimmed to +/- 2% accuracy over the entire voltage and temperature range. Internal low power oscillator (FRO 1 MHz) trimmed to +/- 15% accuracy over the entire voltage and temperature range. Crystal oscillator with an operating frequency of 16 MHz to 32 MHz. Option for external clock input (bypass mode) for clock frequencies of up to 25 MHz. Crystal oscillator with 32.768 KHz operating frequency. Option for external clock input (bypass mode) for clock frequencies of up to 100 kHz. PLL0 and PLL1 allows CPU operation up to the maximum CPU rate without the need for a high-frequency external clock. PLL0 and PLL1 can run from the internal FRO 12 MHz output, the external oscillator, internal FRO 1 MHz output, or the 32.768 KHz RTC oscillator. Clock output function with divider to monitor internal clocks. Frequency measurement unit for measuring the frequency of any on-chip or off-chip clock signal. Each crystal oscillator has one embedded capacitor bank which can be used as an integrated load capacitor. Using APIs, the capacitor banks on each crystal pin can tune the frequency for crystals with a Capacitive Load (CL) which conserves board space and reduces costs. Power-saving modes and wake-up: Integrated PMU (Power Management Unit) to minimize power consumption. Reduced power modes: Sleep, deep-sleep with RAM retention, power-down with RAM retention and CPU retention, and deep power-down with RAM retention. Configurable wake-up options from peripherals interrupts. The Micro-Tick Timer running from the watchdog oscillator, and the Real-Time Clock (RTC) running from the 32.768 kHz clock, can be used to wake-up the device from sleep and deep-sleep modes. Power-On Reset (POR, around 0.8 V). Brown-Out Detectors (BOD) for VBAT_DCDC for forced reset or interrupt. Operating from internal DC-DC converter. Single power supply 1.8 V to 3.6 V. JTAG boundary scan supported. Operating temperature range 40 °C to +105 °C. |
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