GX39221 Datasheet

R08DS0261EU0100 Rev.1.00

Nov 28, 2022

Page 6

Pad #

Name

Type

Description

20

Out2N

RF

Ch 2 RF output, inverting.

21

GNDO

Ground

Ground for output stage.

22

Out2P

RF

Ch 2 RF output, non-inverting.

23

GNDO

Ground

Ground for output stage.

24

GNDO

Ground

Ground for output stage.

25

Out1N

RF

Ch 1 RF output, inverting.

26

GNDO

Ground

Ground for output stage.

27

Out1P

RF

Ch 1 RF output, non-inverting.

28

GNDO

Ground

Ground for output stage/large size pad.

29

VCCO

Power Supply

3.3V positive Bias supply for the output stage.

30

BWCA

DC Digital Input

Digital selection of bandwidth control; works along with BWCB pin.

See Bandwidth Control truth table.

31

OMON1

DC Output

Ch 1 output monitor (peak detector) output

32

VGC1

DC Input or Output

Ch 1 external gain control input (in MGC mode).

Gain Monitor output (in AGC mode).

33

VOA1

DC Input

Ch 1 output level adjustment input (in AGC mode).

34

GCS

DC Digital Input

Ch 1 and Ch 2 selects AGC/Manual Gain control.

35

VCC

Power Supply

3.3V positive Bias supply.

36

VPDS1

PD1 Bias Supply

PD2 Bias supply.

1.

All GNDs to be downbonded first during assembly.

2.

All VCCOs have to be bonded (not short on chip). VCCs are shorted on chip but recommended to be bonded.

3.

In case of single photodiode configuration for each channel, the PDs have to be connected to IN1P and IN2P pads.