PID9v-604e Hardware Specifications

7

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

Table 3 provides the thermal characteristics for the 604e.

Table 4 provides the DC electrical characteristics for the 604e.

Table 3. Thermal Characteristics

Characteristic

Symbol

Value

Rating

CBGA package thermal resistance, die junction-to-top-of-die (typical)

θ

JC

0.1

°C/W

CBGA package thermal resistance, die junction-to-ball (typical)

θ

JB

3.8

°C/W

Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.

Table 4. DC Electrical Specifications

Vdd = AVdd = 2.5

± 5% V dc, OVdd = 3.3 ± 5% V dc, GND = 0 V dc, 0 ≤ Tj ≤ 105 °C

Characteristic

Symbol

Min

Max

Unit

Input high voltage (all inputs except SYSCLK)

VIH

2.0

5.5

V

Input low voltage (all inputs except SYSCLK)

VIL

GND

0.8

V

SYSCLK input high voltage

CVIH

2.4

5.5

V

SYSCLK input low voltage

CVIL

GND

0.4

V

Input leakage current, Vin = 3.465 V

1

Vin = 5.5 V

1

Iin

—10

µA

Iin

—

245

µA

Hi-Z (off-state) leakage current, Vin = 3.465 V

1

Vin = 5.5 V

1

ITSI

—10

µA

ITSI

—

245

µA

Output high voltage, IOH = –9 mA

VOH

2.4

—

V

Output low voltage, IOL = 9 mA

VOL

—

0.4

V

Capacitance, Vin = 0 V, f = 1 MHz

2 (excludes TS, ABB, DBB,

and ARTRY)

Cin

—

10.0

pF

Capacitance, Vin = 0 V, f = 1 MHz

2 (for TS, ABB, DBB, and

ARTRY)

Cin

—

15.0

pF

Notes:

1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and JTAG signals.

2. Capacitance values are guaranteed by design and characterization, and are not tested.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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