| Electronic Components Datasheet Search |
|
SC1211 Datasheet(PDF) 9 Page - Semtech Corporation |
|
|
|||||||||||||||||||||||||||||
SC1211 Datasheet(HTML) 9 Page - Semtech Corporation |
|
9 / 11 page ![]() 9 © 2003 Semtech Corp. www.semtech.com POWER MANAGEMENT SC1211 the DRN (or the Power Phase Node) with the same tim- ing. A RC network (Rcs and Ccs) is connected between VPN and Vout. During Q1 turn-on, Qcst turns on as well. The voltage drop across Q1 and Lo charges Ccs. During Q2 turn-on, Qcsb turns on as well. The voltage drop across Q2 and Lo discharges Ccs. Both voltage drops are pro- portional to the inductor current and a resistance equal to FET’s Rdson plus ESR of the inductor. If the time con- stant Rcs x Ccs is close to the Lo/Ro of the inductor, where Ro is given by ) 1 ( * * _ _ D R D R R Ro ls dson hs dson inductor − + + = the signal developed across Ccs will be proportional to the inductor current, where Ro is the equivalent current sensing resistance. In the above equation, Rinductor is ESR of the inductor, Rdson_hs and Rdson_ls are the top and bottom FET’s Rdson, and D is the duty cycle of the converter. Since a perfect timing match down to the nanosecond is impossible, the VPN totem pole is held in tri-state during the communtations of DRN in the SC1211. This avoids errors and offset on the current detection which can be significant since the timing mismatch is multiplied by the input voltage. An optional capacitor between VPN and DRN allows these two nodes to be AC coupled during the tri-state window, hence yields a perfect timing match. Refer to Semtech SC2643VX Combi-SenseTM Current Mode Controller about the details of the Combi-Sense technique. Optimized Gate Drive Voltage With the supply voltage in between 9V to 16V, an inter- nal LDO is designed with the SC1211 to bring the volt- age to a lower level for gate drive. An external Ceramic capacitor(1uF to 4.7uF) connected in between Vreg to ground is needed to support the LDO. The LDO output is connected to low gate drive internally, and has to be connected to high gate drive through an external boot- strap circuit. The LDO output voltage is set at 8.5V. The manufacture data and bench tested results show that, for low Rdson FETs run at applied load current, the opti- mum gate drive voltage is around 8.5V, where the total power losses of power FETs, including conduction loss and switching loss, are minimized. Applications Information (Cont.) Thermal Shut Down The SC1211 will shut down by pulling both driver out- puts low if its junction temperature, Tj, exceeds 155°C. COMPONENT SELECTION Switching Frequency, Inductor and MOSFETs The SC1211 is capable of providing up to 3.5A peak drive current, and operating up to 1.5MHz PWM frequency without causing thermal stress on the driver. The selec- tion of switching frequency, together with inductor and FETs is a trade-off between the cost, size, and thermal management of a multi-phase voltage regulator. In mod- ern microprocessor applications, these parameters could be in the range of: Switching Frequency 100kHz to 500kHz per phase Inductor Value 0.2uH to 2uH FETs 4m-ohm to 20m-ohm Rdson 20nC to 100nC total gate charge Bootstrap Circuit The SC1211 uses an external bootstrap circuit to pro- vide a voltage for the top FET drive. This voltage, refer- ring to the Phase Node, is held up by a bootstrap capaci- tor. The capacitor value can be calculated based on the total gate charge of the top FET, QTOP, and an allowed voltage ripple on the capacitor, ∆VBST, in one PWM cycle: CBST >QTOP/ ∆VBST Typically, it is recommended to use a 1uF ceramic ca- pacitor with 25V rating and a commonly available diode IN4148 for the bootstrap circuit. In addition, a small re- sistor (one ohm) has to be added in between DRN of the SC1211 and the Phase Node. The resistor is used to allievate the stress of the SC1211 from exposing to the negative spike at the Phase node. A negative spike could occur at the Phase Node during the top FET turn-off due to parasitic inductance in the switching loop. The spike could be minimized with a careful PCB layout. In those applications with TO-220 package FETs, it is recom- mended to use a clamping diode on the DRN pin to miti- gate the impact of the excessive phase node negative spike. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |