Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BUJ100AT

MOUNTING INSTRUCTIONS

Dimensions in mm.

Fig.22. soldering pattern for surface mounting SOT223.

PRINTED CIRCUIT BOARD

Dimensions in mm.

Fig.23. PCB for thermal resistance and power rating for SOT223.

PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35

µm thick).

3.8

min

6.3

2.3

4.6

1.5

min

1.5

min

1.5

min

(3x)

36

60

9

10

4.6

18

4.5

7

15

50

September 1999

7

Rev 1.000