www.ti.com

EXAMPLE STENCIL DESIGN

20X (0.6)

28X (0.25)

24X (0.5)

(3.3)

(3.3)

(0.55) TYP

(0.55) TYP

4X (0.9)

4X (0.9)

(R0.05) TYP

8X (0.575)

4X (R0.12)

VQFN - 1.05 mm max height

RZA0020A

PLASTIC QUAD FLATPACK - NO LEAD

4226858/A 06/2021

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 20X

EXPOSED PAD 21

81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SYMM

SYMM

1

5

6

10

11

15

16

20

21

A

B

C

D