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PCD5032 Datasheet(PDF) 16 Page - NXP Semiconductors

Part # PCD5032
Description  ADPCM CODEC for digital cordless telephones
PDF  24 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCD5032 Datasheet(HTML) 16 Page - NXP Semiconductors

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1997 Apr 03
16
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
11 FILTER CHARACTERISTICS
VDD = 2.7 to 5.5 V; VSS =0V; Tamb = −25 to +70 °C.
Notes
1. Frequency band is 300 Hz to 3400 Hz. Maximum load capacitance = 100 pF differentially, or 200 pF each pin.
2. Measured with psophometric filter (CCITT G.223). Only fulfilled at VDD noise level less than 40 mV (peak value)
(0 to 20 kHz). Measured on sample basis at VDD = 3.0 V,Tamb =25 °C, compliant with G.712. Signal level is
−40 dBm0 on PCM interface; 0.4 mV (RMS) on analog input. Gain setting is 0 dB.
3. Group delay includes ADPCM/PCM conversion; signal frequency = 1.5 kHz. Value given is for RAS/TAS signals
asserted simultaneously.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Transmitter
RPB
passband ripple
(300 to 3000 Hz)
−−
0.5
dB
frequency response
f = 50 Hz
−35
−−2dB
f = 3400 Hz
−35
−−2dB
f = 4600 Hz
−35
−−2dB
f = 8000 Hz
−60
−−2dB
Analog-to-Digital converter
S/N
signal-to-noise ratio
Fig.10; notes 1 and 2
35
−−
dB
Digital-to-Analog converter
S/N
signal-to-noise ratio
Fig.10; notes 1 and 2
35
−−
dB
Group delay
td(TX)
transmitter
note 3
−−
400
µs
td(RX)
receiver
note 3
−−
525
µs
td(g)
group delay distortion (Loop 1)
Fig.11
tbf
tbf
tbf
µs
handbook, halfpage
MGK078
22
27
33
10
0
20
30
40
50
60
70
80
−60
−70
−50 −40 −30 −20 −10 0 +10
input level (dBm0)
S/(N
+ THD)
G.712
Fig.10 Typical performance of AD and DA in
cascade.
handbook, halfpage
MGK077
0.0
td(g)
250.0
µs
500.0
µs
750.0
µs
1.0 ms
1.5 ms
1.75 ms
1.25 ms
300
500
600 1000
1500
2600
2800
3400
CCITT G.712
frequency (Hz)
Fig.11 Group delay distortion: Transmit and
Receive (loop measurement).



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