Analog Integrated Circuit Device Data

6

Freescale Semiconductor

33689

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RATINGS

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

°C

Storage Temperature

-55 to 165

°C

Thermal Resistance, Junction-to-Ambient

80

°C/W

Peak Package Reflow Temperature During Solder Mounting (2)

240

°C

Notes

2.

Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause permanent damage to the device.

Figure 4. ISO 7637 Test Setup for LIN, L1, and L2 Pins

Table 2. Maximum Ratings(continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

LIN, L1, L2

Transient Pulse

GND

Generator

1.0 nF

(Note)

10 k

Ω

Note Waveform per ISO 7637-1. Test Pulses 1, 2, 3a, and 3b.

GND

33689D

TGND AGND