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DS28EC20 Datasheet(PDF) 3 Page - Dallas Semiconductor

Part # DS28EC20
Description  20Kb 1-Wire EEPROM
PDF  24 Pages
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Manufacturer  DALLAS [Dallas Semiconductor]
Direct Link  https://www.maximintegrated.com/en.html
Logo DALLAS - Dallas Semiconductor

DS28EC20 Datasheet(HTML) 3 Page - Dallas Semiconductor

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DS28EC20: 20Kb 1-Wire EEPROM
3 of 24
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
EEPROM
Programming Current
IPROG
(Note 19)
0.8
mA
Programming Time
tPROG
(Note 20)
10
ms
At +25°C
200k
Write/Erase Cycles
(Endurance) (Notes 21,
22)
NCY
At +85°C (worst case)
50k
⎯
Data Retention
(Notes 23, 24, 25)
tDR
At +85°C (worst case)
40
years
Note 1:
Specifications at TA = -40°C are guaranteed by design only and not production-tested.
Note 2:
System requirement.
Note 3:
Maximum allowable pullup resistance is a function of the number of 1-Wire devices in the system, 1-Wire recovery times, and
current requirements during EEPROM programming. The specified value here applies to systems with only one device and with
the minimum 1-Wire recovery times. For more heavily loaded systems, an active pullup such as that found in the DS2482-x00,
DS2480B, or DS2490 may be required.
Note 4:
Maximum value represents the internal parasite capacitance when VPUP is first applied. If a 2.2kΩ resistor is used to pull up the
data line, 2.5µs after VPUP has been applied the parasite capacitance does not affect normal communications.
Note 5:
Guaranteed by design, characterization and/or simulation only. Not production tested.
Note 6:
VTL, VTH, and VHY are a function of the internal supply voltage which is itself a function of VPUP, RPUP, 1-Wire timing, and
capacitive loading on I/O. Lower VPUP, higher RPUP, shorter tREC, and heavier capacitive loading all lead to lower values of VTL, VTH,
and VHY.
Note 7:
Voltage below which, during a falling edge on I/O, a logic 0 is detected.
Note 8:
The voltage on I/O needs to be less or equal to VILMAX at all times the master is driving I/O to a logic 0 level.
Note 9:
Voltage above which, during a rising edge on I/O, a logic 1 is detected.
Note 10:
After VTH is crossed during a rising edge on I/O, the voltage on I/O has to drop by at least VHY to be detected as logic 0.
Note 11:
The I-V characteristic is approximately linear for voltages less than 1V.
Note 12:
Applies to a single device attached to a 1-Wire line.
Note 13:
The earliest recognition of a negative edge is possible at tREH after VTH has been reached on the preceding rising edge.
Note 14:
Defines maximum possible bit rate. Equal to 1/(tW0LMIN + tRECMIN).
Note 15:
Interval after tRSTL during which a bus master is guaranteed to sample a logic 0 on I/O if there is a DS28EC20 present. Minimum
limit is tPDHMAX; maximum limit is tPDHMIN + tPDLMIN.
Note 16:
Highlighted numbers are NOT in compliance with legacy 1-Wire product standards. See comparison table below.
Note 17:
ε in Figure 11 represents the time required for the pullup circuitry to pull the voltage on I/O up from V
IL to VTH. The actual
maximum duration for the master to pull the line low is tW1LMAX + tF - ε and tW0LMAX + tF - ε, respectively.
Note 18:
δ in Figure 11 represents the time required for the pullup circuitry to pull the voltage on I/O up from V
IL to the input high threshold
of the bus master. The actual maximum duration for the master to pull the line low is tRLmax + tF.
Note 19:
Current drawn from I/O during the EEPROM programming interval. During a programming cycle the voltage at I/O drops by IPROG
× RPUP below VPUP. If VPUP and RPUP are within their EC table limits, the residual I/O voltage meets the guaranteed-by-design
minimum voltage requirements for programming.
Note 20:
The tPROG interval begins tREHMAX after the leading negative edge on I/O for the last time slot of the E/S byte for a valid copy
scratchpad sequence. Interval ends once the device's self-timed EEPROM programming cycle is complete and the current drawn
by the device has returned from IPROG to IL.
Note 21:
Write-cycle endurance is degraded as TA increases.
Note 22:
Not 100% production-tested; guaranteed by reliability monitor sampling.
Note 23:
Data retention is degraded as TA increases.
Note 24:
Guaranteed by 100% production test at elevated temperature for a shorter time; equivalence of this production test to data sheet
limit at operating temperature range is established by reliability testing.
Note 25:
EEPROM writes may become nonfunctional after the data retention time is exceeded. Long-time storage at elevated
temperatures is not recommended; the device may lose its write capability after 10 years at +125°C or 40 years at +85°C.
LEGACY VALUES
DS28EC20 VALUES
PARAMETER
STANDARD SPEED
OVERDRIVE SPEED
STANDARD SPEED
OVERDRIVE SPEED
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
tSLOT (incl. tREC)
61µs
(undefined)
7µs
(undefined)
65µs*
(undefined)
8µs*
(undefined)
tRSTL
480µs
(undefined)
48µs
80µs
480µs
640µs
48µs
80µs
tPDH
15µs
60µs
2µs
6µs
15µs
60µs
2µs
6µs
tPDL
60µs
240µs
8µs
24µs
60µs
240µs
8µs
24µs
tW0L
60µs
120µs
6µs
16µs
60µs
120µs
6µs
15.5µs
* Intentional change, longer recovery time requirement due to modified 1-Wire front-end.



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