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H838024 Datasheet(PDF) 59 Page - Renesas Technology Corp |
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H838024 Datasheet(HTML) 59 Page - Renesas Technology Corp |
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59 / 697 page ![]() Section 1 Overview Rev. 7.00 Mar 10, 2005 page 17 of 652 REJ09B0042-0700 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 (0.0) Y X Chip size: 2.91 mm × 2.91 mm Voltage level on the back of the chip: GND Figure 1.7 Bonding Pad Location Diagram of HCD64338024S, HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S (Top View) |
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