TLV9062IDDFR datasheet(29/93 Pages) TI

29 / 93 page

• Added YCK packages to the Device Comparison table..................................................................................... 3

• Added TLV9062S YCK (DSBGA) pinout drawing to Pin Configuration and Functions section.......................... 4

Changes from Revision I (May 2019) to Revision J (September 2019)

Page

• Deleted TLV9062IDDFR (SOT-23, 8) package preview notations throughout data sheet................................. 1

• Added industry standard package names to Device Comparison Table ........................................................... 3

• Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–......4

• Added link to Shutdown Function section in SHDN pin function rows................................................................4

• Added EMI Rejection section to the Feature Description section.....................................................................21

• Changed Shutdown Function section to add more clarification .......................................................................22

Changes from Revision H (April 2019) to Revision I (May 2019)

Page

• Added DDF (SOT-23) thermal information to replace TBDs............................................................................ 10

Changes from Revision G (December 2018) to Revision H (April 2019)

Page

• Added (SOT-23, 8) information to Device Information .......................................................................................1

• Added DDF package column to Device Comparison Table .............................................................................. 3

• Added DDF (SOT-23) package, to Pin Functions ..............................................................................................4

• Added DDF (SOT-23) package to Thermal Information .................................................................................. 10

Changes from Revision F (September 2018) to Revision G (December 2018)

Page

• Changed TLV9064 RUC package name from: (WQFN, 14) to: (X2QFN, 14) in Device Information table.........1

• Added RUC (X2QFN) package, pinout information to Pin Functions: TLV9064 table........................................4

• Added TLV9064 RUC (X2QFN) pinout drawing to Pin Configuration and Functions section.............................4

• Added RUC (X2QFN) to Thermal Information: TLV9064 table.........................................................................11

Changes from Revision E (July 2018) to Revision F (September 2018)

Page

• Deleted Shutdown part numbers from data sheet header .................................................................................1

• Deleted (X2QFN, 10) package from TLV9062 Device Information table............................................................1

• Added references to shutdown part numbers in Description section ................................................................ 1

• Changed TLV906xS series to TLV906xS family throughout data sheet.............................................................1

• Added Shutdown devices to Device Comparison Table .................................................................................... 3

• Changed pin namings for all pinout drawings to reflect updated nomenclature ................................................4

• Added TLV9061S Thermal Information Table...................................................................................................10

• Added TLV9064S Thermal Information Table................................................................................................... 11

• Deleted Partial Shutdown Amplifier Enable Time.............................................................................................12

• Added clarification on selecting resistors for a current sensing application in the Typical Applications

Section .............................................................................................................................................................24

• Changed wording of third bullet in Layout Guidelines...................................................................................... 26

Changes from Revision D (June 2018) to Revision E (July 2018)

Page

• Added TLV9061S device to Device Information table........................................................................................ 1

• Added TLV9064S device to Device Information table........................................................................................ 1

• Added RUC and RUG packages to the Device Comparison table.....................................................................3

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TLV9061, TLV9062, TLV9064

SBOS839L – MARCH 2017 – REVISED SEPTEMBER 2024

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TLV9062IDDFR Datasheet(PDF) 29 Page - Texas Instruments

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