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TLV9062IDDFR Datasheet(PDF) 33 Page - Texas Instruments |
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TLV9062IDDFR Datasheet(HTML) 33 Page - Texas Instruments |
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33 / 93 page  www.ti.com EXAMPLE BOARD LAYOUT 0.0375 MIN 0.0375 MAX 9X ( 0.18) (0.35) TYP (0.35) TYP ( 0.18) SOLDER MASK OPENING ( 0.18) METAL 4226891/A 06/2021 DSBGA - 0.33 mm max height YCK0009-C01 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 3 A B EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 50X NON-SOLDER MASK DEFINED EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK EXPOSED METAL www.ti.com TLV9061, TLV9062, TLV9064 SBOS839L – MARCH 2017 – REVISED SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: TLV9061 TLV9062 TLV9064 |
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