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TPCF8104 Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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TPCF8104 Datasheet(HTML) 2 Page - Toshiba Semiconductor |
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2 / 7 page ![]() TPCF8104 2006-11-16 2 Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to ambient (t = 5 s) (Note 2a) Rth (ch-a) 50.0 °C/W Thermal resistance, channel to ambient (t = 5 s) (Note 2b) Rth (ch-a) 178.6 °C/W Marking (Note 5) Note 1: Ensure that the channel temperature does not exceed 150℃. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) Note 3: VDD = −24 V, Tch = 25°C (initial), L = 0.5 mH, RG = 25 Ω, IAR = −3.0 A Note 4: Repetitive rating: pulse width limited by maximum channel temperature Note 5: ● on the lower leftof the marking indicates Pin 1. (b) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (a) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) Part No. (or abbreviation code) F3D A line indicates lead (Pb)-free package or lead (Pb)-free finish. Lot code (month) Lot No. Pin #1 Lot code (year) Product-specific code |
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