STM32G474RC datasheet(11/232 Pages) STMICROELECTRONICS

11 / 232 page

DS12288 Rev 1

11/232

STM32G474xB STM32G474xC STM32G474xE

List of figures

Figure 49.

NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 197

Figure 50.

NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 198

Figure 51.

Quad SPI timing diagram - SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

Figure 52.

Quad SPI timing diagram - DDR mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

Figure 53.

WLCSP - 81 balls, 4.02x4.27 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202

Figure 54.

WLCSP - 81 balls, 4.02x4.27 mm, 0.4 mm pitch wafer level chip scale

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203

Figure 55.

UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204

Figure 56.

UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205

Figure 57.

UFQFPN48, 7 x 7 mm, low-profile quad flat package top view example . . . . . . . . . . . . . 206

Figure 58.

LQFP - 48 pins, 7 x 7 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . . . . 207

Figure 59.

LQFP - 48 pins, 7 x 7 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209

Figure 60.

LQFP48, 7 x 7 mm, low-profile quad flat package top view example . . . . . . . . . . . . . . . . 210

Figure 61.

LQFP - 64 pins, 10 x 10 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . . 211

Figure 62.

LQFP - 64 pins, 10 x 10 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

Figure 63.

LQFP64, 10 x 10 mm, low-profile quad flat package top view example . . . . . . . . . . . . . 213

Figure 64.

LQFP - 80 pins, 12 x 12 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . . 214

Figure 65.

LQFP - 80 pins, 12 x 12 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215

Figure 66.

LQFP80, 12 x 12 mm, low-profile quad flat package top view example . . . . . . . . . . . . . . 216

Figure 67.

TFBGA - 100 balls, 8X8 mm, 0.8 mm pitch fine pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217

Figure 68.

TFBGA - 100 balls, 8X8 mm, 0.8 mm pitch fine pitch ball grid array

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

Figure 69.

TFBGA100 - 8 x 8 mm, low-profile quad flat package top view example . . . . . . . . . . . . 219

Figure 70.

LQFP - 100 pins, 14 x 14 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . 220

Figure 71.

LQFP - 100 pins, 14 x 14 mm low-profile quad flat

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221

Figure 72.

LQFP100 - 14 x 14 mm, low-profile quad flat package top view example . . . . . . . . . . . . 222

Figure 73.

LQFP - 128 pins, 14 x 14 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . 223

Figure 74.

LQFP128 - 14 x 14 mm, low-profile quad flat package top view example . . . . . . . . . . . . 225

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