STM32F205RFT6 datasheet(183/184 Pages) STMICROELECTRONICS

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DocID15818 Rev 15

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STM32F20xxx

Revision history

183

04-Nov-2013

(continued)

Removed Appendix A Application block diagrams.

Updated Figure 77: LQFP64 – 10 x 10 mm 64 pin low-profile quad flat

package outline and Table 87: LQFP64 – 10 x 10 mm 64 pin low-profile

quad flat package mechanical data. Updated Figure 80: LQFP100, 14 x

14 mm 100-pin low-profile quad flat package outline, Figure 83:

LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline,

Figure 86: LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm,

package outline. Updated Figure 88: UFBGA176+25 - ultra thin fine

pitch ball grid array 10 × 10 × 0.6 mm, package outline and Figure 88:

UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm,

package outline.

27-Oct-2014

Updated VBAT voltage range in Figure 19: Power supply scheme. Added

caution note in Section 6.1.6: Power supply scheme.

Updated VIN in Table 14: General operating conditions.

Removed note 1 in Table 23: Typical and maximum current

consumptions in Stop mode.

Updated Table 45: I/O current injection susceptibility, Section 6.3.16:

I/O port characteristics and Section 6.3.17: NRST pin characteristics.

Removed note 3 in Table 69: Temperature sensor characteristics.

Updated Figure 79: WLCSP64+2 - 0.400 mm pitch wafer level chip size

package outline and Table 88: WLCSP64+2 - 0.400 mm pitch wafer

level chip size package mechanical data. Added Figure 83: LQFP100

marking (package top view) and Figure 86: LQFP144 marking (package

top view).

2-Feb-2016

Updated Section 1: Introduction.

Updated Table 32: HSI oscillator characteristics and its footnotes.

Updated Figure 36: PLL output clock waveforms in center spread mode,

Figure 37: PLL output clock waveforms in down spread mode,

Figure 54: Power supply and reference decoupling (VREF+ not

connected to VDDA) and Figure 55: Power supply and reference

decoupling (VREF+ connected to VDDA).

Updated Section 7: Package information and its subsections.

24-Jun-2016

Updated figures 1, 2 and 3 in Section 2.1: Full compatibility throughout

the family.

Updated Device marking and Figure 83 in Section 7.3: LQFP100

package information.

Updated Device marking and Figure 86 in Section 7.4: LQFP144

package information.

Updated Section 7.6: UFBGA176+25 package information with

introduction of Device marking and Figure 91.

Updated Table 96: Ordering information scheme.

11-Aug-2016

Updated Features, Section 7.2: WLCSP64+2 package information and

title of Section 8: Ordering information.

Updated Figure 54: Power supply and reference decoupling (VREF+

not connected to VDDA).

Table 97. Document revision history (continued)

Date

Revision

Changes

STM32F205RFT6 Datasheet(PDF) 183 Page - STMicroelectronics

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