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STM32L496QGI3 Datasheet(PDF) 245 Page - STMicroelectronics |
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STM32L496QGI3 Datasheet(HTML) 245 Page - STMicroelectronics |
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245 / 262 page  DocID029173 Rev 1 245/262 STM32L496xx Package information 259 Figure 67. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package recommended footprint e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 124. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm Table 123. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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