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ISO7641FC Datasheet(PDF) 20 Page - Texas Instruments

Part # ISO7641FC
Description  ISO76x1 Low-Power Triple and Quad-Channels Digital Isolators
PDF  37 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

ISO7641FC Datasheet(HTML) 20 Page - Texas Instruments

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OSC
PWM
VREF
LPF
VREF
DCL
OUT
IN
0
1 S
Isolation Barrier
Low t Frequency
Channel
(DC...100 kbps)
High t Frequency
Channel
(100 kbps...25 Mbps)
Polarity and
Threshold Selection
Polarity and Threshold Selection
Copyright © 2016, Texas Instruments Incorporated
20
ISO7631FM, ISO7631FC, ISO7641FC
SLLSEC3F – SEPTEMBER 2012 – REVISED APRIL 2016
www.ti.com
Product Folder Links: ISO7631FM ISO7631FC ISO7641FC
Submit Documentation Feedback
Copyright © 2012–2016, Texas Instruments Incorporated
Functional Block Diagram (continued)
(1)
Per JEDEC package dimensions.
(2)
Measured from input pin to ground.
Figure 21. ISO7631FC and ISO7641FC Conceptual Block Diagram
9.3 Feature Description
9.3.1 Package Insulation and Safety-Related Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
L(I01)
Minimum air gap (Clearance)
Shortest terminal to terminal distance through air
8
mm
L(I02)(1)
Minimum external tracking
(Creepage)
Shortest terminal to terminal distance across the
package surface
8
mm
CTI
Tracking resistance (Comparative
Tracking Index)
DIN EN 60112 (VDE 0303-11); IEC 60112
≥400
V
DTI
Minimum Internal Gap (Internal
Clearance)
Distance through the insulation
0.014
mm
CI
(2)
Input capacitance
VI = VCC/2 + 0.4 sin (2πft), f = 1MHz, VCC = 5 V
2
pF
spacer
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed circuit board do not reduce this distance.
Creepage and clearance on a printed circuit board become equal according to the
measurement techniques shown in the Isolation Glossary. Techniques such as inserting
grooves and/or ribs on a printed circuit board are used to help increase these
specifications.



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