LM7332

SNOSAV4B – APRIL 2008 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2)

MIN

MAX

UNIT

VIN differential

±10

V

Output short-circuit duration

See (3)(4)

Supply voltage (VS = V

+ – V−)

35

V

Voltage at input/output pins

V+ + 0.3

V−

− 0.3

V

Junction temperature(5)

150

°C

Infrared or convection (20 sec.)

235

°C

Soldering information

Wave soldering (10 sec.)

260

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

(3)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(4)

Short-circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ 6 V at room temperature and below. For VS > 6 V,

allowable short circuit duration is 1.5 ms.

(5)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PC board.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V(ESD)

Electrostatic discharge

V

Machine model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage (VS = V

+ – V−)

2.5

32

V

Temperature range(1)

−40

125

°C

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

6.4 Thermal Information

LM7332

THERMAL METRIC(1)

DGK (VSSOP)

D (SOIC)

UNIT

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance (2)

161.1

109.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

55

55.8

°C/W

RθJB

Junction-to-board thermal resistance

80.5

49.2

°C/W

ψJT

Junction-to-top characterization parameter

5.5

10.7

°C/W

ψJB

Junction-to-board characterization parameter

79.2

48.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

4

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