5

SN74LVC1404

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SCES469F – AUGUST 2003 – REVISED MARCH 2020

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Copyright © 2003–2020, Texas Instruments Incorporated

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(2)

CTRL = Low, XIN = GND

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

Operating

1.65

5.5

V

Data retention only

1.5

VI

Input voltage (XIN, CTRL, A inputs)

0

5.5

V

VO

Output voltage (XOUT, OSCOUT, Y outputs)

0

VCC

V

IOH

High-level output current (OSCOUT, XOUT, Y outputs)

VCC = 1.65 V

–4

mA

VCC = 2.3 V

–8

VCC = 3 V

–16

–24

VCC = 4.5 V

–32

IOL

Low-level output current (OSCOUT, XOUT, Y outputs)

VCC = 1.65 V

4

mA

VCC = 2.3 V

8

VCC = 3 V

16

24

VCC = 4.5 V

32

IOL

(2)

Low-level output current (XOUT)

VCC = 1.65 V

2

mA

Δt/Δv

Input transition rise and fall time (CTRL input)

VCC = 1.8 V ± 0.15 V

20

ns/V

VCC = 2.5 V ± 0.2 V

20

VCC = 3.3 V ± 0.3 V

10

VCC = 5 V ± 0.5 V

5

TA

Operating free-air temperature

DCU, DCT

–40

125

°C

YZP

–40

85

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.4 Thermal Information

THERMAL METRIC(1)

DCT

DCU

YZP

UNIT

8 PINS

8 PINS

8 BALLS

RθJA

Junction-to-ambient thermal resistance

184.8

198.4

97.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

115.3

73.5

1.1

RθJB

Junction-to-board thermal resistance

97.3

77.1

26.3

ψJT

Junction-to-top characterization parameter

40.9

6.1

0.5

ψJB

Junction-to-board characterization parameter

96.3

76.7

26.2