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LM5025AMTC/NOPB Datasheet(PDF) 4 Page - Texas Instruments

Part # LM5025AMTC/NOPB
Description  LM5025A Active Clamp Voltage Mode PWM Controller
PDF  34 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM5025AMTC/NOPB Datasheet(HTML) 4 Page - Texas Instruments

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LM5025A
SNVS293F – DECEMBER 2004 – REVISED AUGUST 2016
www.ti.com
Product Folder Links: LM5025A
Submit Documentation Feedback
Copyright © 2004–2016, Texas Instruments Incorporated
Pin Functions (continued)
PIN
I/O
DESCRIPTION
APPLICATION INFORMATION
NO.
NAME
9
OUT_B
O
Active Clamp output driver
Output of the Active Clamp switch gate driver.
Capable of 1.25-A peak sink current..
10
PGND
G
Power ground
Connect directly to analog ground.
11
AGND
G
Analog ground
Connect directly to power ground. For the WSON
package option, the exposed pad is electrically
connected to AGND.
12
SS
I
Soft-start control
An external capacitor and an internal 20-µA current
source set the soft-start ramp. The SS current
source is reduced to 1 µA initially following a CS2
overcurrent event or an overtemperature event.
13
COMP
I
Input to the Pulse Width Modulator
An internal 5-kΩ resistor pullup is provided on this
pin. The external opto-coupler sinks current from
COMP to control the PWM duty cycle.
14
RT
I
Oscillator timing resistor pin
An external resistor connected from RT to ground
sets the internal oscillator frequency.
15
SYNC
I
Oscillator UP and DOWN
synchronization input
The internal oscillator can be synchronized to an
external clock with a frequency 20% lower than the
internal oscillator’s free running frequency. There is
no constraint on the maximum sync frequency.
16
UVLO
I
Line undervoltage shutdown
An external voltage divider from the power source
sets the shutdown comparator levels. The
comparator threshold is 2.5 V. Hysteresis is set by
an internal current source (20 µA) that is switched
ON or OFF as the UVLO pin potential crosses the
2.5-V threshold.
—
EP
G
Exposed pad, underside of the
WSON package option
Internally bonded to the die substrate. Connect to
GND potential for low thermal impedance.



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