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LMH6702

SNOSA03H – NOVEMBER 2002 – REVISED MAY 2016

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Copyright © 2002–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The maximum output current (IOUT) is determined by device power dissipation limitations.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VS

±6.75

V

IOUT

See(3)

Common mode input voltage

V− to V+

V

Maximum junction temperature

150

°C

Storage temperature

−65

150

°C

Soldering information

Infrared or convection (20 s)

235

°C

Wave soldering (10 s)

260

°C

(1)

Human body model: 1.5 k

Ω in series with 100 pF. JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a

standard ESD control process. Manufacturing with less than 2000-V HBM is possible with the necessary precautions. Pins listed as

±2000 V may actually have higher performance.

(2)

Machine model: 0

Ω in series with 200 pF. JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard

ESD control process. Manufacturing with less than 200-V MM is possible with the necessary precautions. Pins listed as ±200 V may

actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Machine Model (MM), per JEDEC specification JESD22-C101, all pins(2)

±200

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics tables.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Operating temperature

−40

85

°C

Nominal supply voltage

±4

±6

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.4 Thermal Information

THERMAL METRIC(1)

LMH6702

UNIT

DBV (SOT-23)

D (SOIC)

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

182

133

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

139

79

°C/W

RθJB

Junction-to-board thermal resistance

40

73

°C/W

ψJT

Junction-to-top characterization parameter

28

28

°C/W

ψJB

Junction-to-board characterization parameter

40

73

°C/W