© 2001 Fairchild Semiconductor Corporation

www.fairchildsemi.com

KA78M05 / LM78M05 / MC78M05 Rev. 2.5

2

Block Diagram

Figure 1. Block Diagram

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only.

Notes:

2. Thermal resistance test board.

Size: 76.2 mm x 114.3 mm x 1.6 mm (1S0P)

JEDEC standard: JESD51-3, JESD51-7

3. Assume no ambient airflow.

Symbol

Parameter

Value

Unit

VI

Input Voltage (for VO = 5 V)

35

V

RθJC

Thermal Resistance, Junction-Case(2)

TO-220 (TC = +25°C)

2.5

°C/W

RθJA

Thermal Resistance, Junction-Air(2), (3)

TO-220 (TA = +25°C)

66

°C/W

D-PAK (TA = +25°C)

92

TOPR

Operating Junction Temperature Range

-40 to +125

°C

TJ(MAX)

Maximum Junction Temperature Range

150

°C

TSTG

Storage Temperature Range

-65 to +150

°C

OUTPUT

3

R1

R2

GND

2

1

INPUT

SERIES

PASS

ELEMENT

SOA

PROTECTION

CURRENT

GENERATOR

STARTING

CIRCUIT

REFERENCE

VOLTAGE

ERROR

AMPLIFIER

THERMAL

PROTECTION