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MB85R8M2TA Datasheet(PDF) 20 Page - RAMXEED LIMITED |
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MB85R8M2TA Datasheet(HTML) 20 Page - RAMXEED LIMITED |
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20 / 30 page ![]() 20 DS501-00070-2v1-E MB85R8M2TA PACKAGE DIMENSIONS Lead pitch 0.75mm Package width× Package length 8.00 mm × 6.00 mm Sealing method Plastic mold Mounting hight 1.00 mm (max.) MB85R8M2TABGL-G-JAE1 lead shape Solder ball 48-pin plastic FBGA MB85R8M2TABGL-G-JAE1 Dimenstion in mm. 48-pin plastic FBGA 0.17MIN |
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