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STA369BW Datasheet(PDF) 85 Page - STMicroelectronics

Part # STA369BW
Description  2.1-channel high-efficiency digital audio system Sound Terminal
PDF  89 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STA369BW Datasheet(HTML) 85 Page - STMicroelectronics

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STA369BW
Package thermal characteristics
89
10
Package thermal characteristics
Using a four-layer PCB, the thermal resistance junction-to-ambient with 2 copper ground
areas of 6 x 4 cm2 and with 24 via holes (see Figure 36) is 17 °C/W in natural air
convection.
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
Thus, the maximum estimated dissipated power for the STA369BW is:
Figure 36. Double-layer PCB with 2 copper ground areas and 24 via holes
Figure 37 shows the power derating curve for the PowerSSO-36 slug-down package on
PCBs with copper areas of 5 x 4 cm2 and 6 x 4cm2.
Figure 37. PowerSSO-36 power derating curve
2 x 40 W @ 8
, 25.5 V
Pd max ~ 8 W
2 x 17 W + 1 x 35 W @ 4
, 8 ,25 V
Pd max < 7 W
AM045200v1
0
1
2
3
4
5
6
7
8
0
20
40
60
80
100
120
140
160
Pd (W)
Tamb ( °C)
Copper Area 5x4 cm
and 20 via holes
STA350BW
Power-SSO36
Copper Area 6x4 cm
and 24 via holes
Copper Area 5x4 cm
and 20 via holes
STA369BW
Power-SSO36
Copper Area 6x4 cm
and 24 via holes
AM045201v1



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