6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VBB

Load supply voltage(2)

–0.3

40

V

VCP and CP2

Charge Pump Voltage

–0.3

VBB+17V

V

Output current

–2.8

2.8

A

VSense

Sense voltage

–500

500

mV

VBB to OUTx

36

V

OUTx to SENSE

36

V

VDD

PHASE, ENABLE, MODE, MODE1, MODE2, nSLEEP and nFAULT(2)

–0.3

7

V

Continuous total power dissipation

See Section 6.4

TA

Operating free-air temperature

–40

85

°C

TJ

Maximum junction temperature

150

°C

Tstg

Storage temperature

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VIN

Input voltage, VBB

8

32

38

V

VDD

Logic Supply Voltage

0

5.5

V

f(PWM)

Applied PMW signal (PHASE and ENABLE)

0

100

kHz

TA

Operating free-air temperature

–40

85

°C

6.4 Thermal Information

THERMAL METRIC(1)

DRV880x

UNIT

RTY (WQFN)

PWP (HTSSOP)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

38.1

43.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36.7

30.8

RθJB

Junction-to-board thermal resistance

16.1

25.3

ψJT

Junction-to-top characterization parameter

0.3

1.1

ψJB

Junction-to-board characterization parameter

16.2

25

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.1

5.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

www.ti.com

DRV8800, DRV8801

SLVS855K – JULY 2008 – REVISED MARCH 2021

Copyright © 2021 Texas Instruments Incorporated

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