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LM43602PWPR Datasheet(PDF) 39 Page - Texas Instruments |
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LM43602PWPR Datasheet(HTML) 39 Page - Texas Instruments |
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39 / 51 page ![]() www.ti.com PACKAGE OUTLINE C A A 16X 0.3 0.2 4.35±0.1 2X 3.5 2.45±0.1 14X 0.5 1 MAX 16X 0.5 0.3 0.05 0.00 A 4.1 3.9 B 5.1 4.9 (0.2) TYP (0.08) (0.05) VSON - 1 mm max height DSU0016A PLASTIC SMALL OUTLINE - NO LEAD 4222160/A 09/2015 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 8 9 16 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.000 SCALE 30.000 SECTION A-A SECTION A-A TYPICAL 39 LM43602 www.ti.com SNVSA36C – APRIL 2014 – REVISED OCTOBER 2017 Product Folder Links: LM43602 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated |
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