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MSP430FR2000IRLL Datasheet(PDF) 2 Page - Texas Instruments

Part # MSP430FR2000IRLL
Description  MSP430FR21xx, MSP430FR2000 Mixed-Signal Microcontrollers
PDF  85 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

MSP430FR2000IRLL Datasheet(HTML) 2 Page - Texas Instruments

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3 Description
MSP430FR2000 and MSP430FR21xx devices are part of the MSP430™ microcontroller (MCU) value line
sensing portfolio. This ultra-low-power, low-cost MCU family offers memory sizes from 0.5KB to 4KB of
FRAM unified memory with several package options including a small 3-mm×3-mm VQFN package. The
architecture, FRAM, and integrated peripherals, combined with extensive low-power modes, are optimized
to achieve extended battery life in portable, battery-powered sensing applications. MSP430FR2000 and
MSP430FR21xx devices offer a migration path for 8-bit designs to gain additional features and functionality from
peripheral integration and the data-logging and low-power benefits of FRAM. Additionally, existing designs using
MSP430G2x MCUs can migrate to the MSP430FR2000 and MSP430F21xx family to increase performance and
get the benefits of FRAM.
The MSP430FR2000 and MSP430FR21xx MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a
constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also
allows the device to wake up from low-power modes to active mode typically in less than 10 μs. The feature
set of this MCU meets the needs of applications ranging from appliance battery packs and battery monitoring to
smoke detectors and fitness accessories.
The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a
holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering
energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM
with the nonvolatile behavior of flash.
MSP430FR2000 and MSP430FR21x MCUs are supported by an extensive hardware and software ecosystem
with reference designs and code examples to get your design started quickly. Development kits include the
MSP-EXP430FR2311 and MSP430FR4133 LaunchPad™ development kit and the MSP
‑TS430PW20 20-pin
target development board. TI also provides free MSP430Ware™ software, which is available as a component of
Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. MSP430 MCUs are also
supported by extensive online collateral, such as our housekeeping example series, MSP Academy training, and
online support through the TI E2E™ support forums.
For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
Device Information
PART NUMBER(1)
PACKAGE
BODY SIZE(2)
MSP430FR2111IPW16
TSSOP (16)
5 mm × 4.4 mm
MSP430FR2110IPW16
MSP430FR2100IPW16
MSP430FR2000IPW16
MSP430FR2111IRLL
VQFN (24)
3 mm × 3 mm
MSP430FR2110IRLL
MSP430FR2100IRLL
MSP430FR2000IRLL
(1)
For the most current part, package, and ordering information, see the Package Option Addendum
in Section 12, or see the TI website at www.ti.com.
(2)
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 12.
CAUTION
System-level ESD protection must be applied in compliance with the device-level ESD specification
to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level
ESD Considerations for more information.
MSP430FR2111, MSP430FR2110, MSP430FR2100, MSP430FR2000
SLASE78E – AUGUST 2016 – REVISED JUNE 2021
www.ti.com
2
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: MSP430FR2111 MSP430FR2110 MSP430FR2100 MSP430FR2000



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