SN54LVC541A, SN74LVC541A

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SCAS298N – JANUARY 1993 – REVISED JUNE 2014

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

SN54LVC541A

SN74LVC541A

UNIT

MIN

MAX

MIN

MAX

Operating

2

3.6

1.65

3.6

VCC

Supply voltage

V

Data retention only

1.5

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VIH

High-level input voltage

VCC = 2.3 V to 2.7 V

1.7

V

VCC = 2.7 V to 3.6 V

2

2

VCC = 1.65 V to 1.95 V

0.35 × VCC

VIL

Low-level input voltage

VCC = 2.3 V to 2.7 V

0.7

V

VCC = 2.7 V to 3.6 V

0.8

0.8

VI

Input voltage

0

5.5

0

5.5

V

High or low state

0

VCC

0

VCC

VO

Output voltage

V

3-state

0

5.5

0

5.5

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

mA

VCC = 2.7 V

–12

–12

VCC = 3 V

–24

–24

VCC = 1.65 V

4

VCC = 2.3 V

8

IOL

Low-level output current

mA

VCC = 2.7 V

12

12

VCC = 3 V

24

24

TA

Operating free-air temperature

–55

125

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

7.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

SN74LVC541A

THERMAL METRIC(1)

DB

DGV

DW

NS

PW

UNIT

20 PINS

RθJA

Junction-to-ambient thermal resistance

112.1

128.9

99.4

90.3

100.8

RθJC(top)

Junction-to-case (top) thermal resistance

73.6

43.8

66.9

56.6

35.2

RθJB

Junction-to-board thermal resistance

67.3

70.4

66.9

57.8

51.8

°C/W

ψJT

Junction-to-top characterization parameter

33.3

3.2

33.8

28.7

2.2

ψJB

Junction-to-board characterization parameter

66.9

69.7

66.5

57.4

51.2

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, literature

number SPRA953.

Copyright © 1993–2014, Texas Instruments Incorporated

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