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THS4502/3 Datasheet(PDF) 28 Page - Texas Instruments |
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THS4502/3 Datasheet(HTML) 28 Page - Texas Instruments |
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28 / 51 page ![]() PC BOARD LAYOUT TECHNIQUES FOR THS4504 THS4505 SLOS363D – AUGUST 2002 – REVISED MAY 2008 ......................................................................................................................................................... www.ti.com add a pole and/or a zero below 400 MHz that can OPTIMAL PERFORMANCE effect circuit operation. Keep resistor values as low as possible, consistent with load driving Achieving optimum performance with a high considerations. frequency amplifier-like devices in the THS4500 • Connections to other wideband devices on the family requires careful attention to board layout board may be made with short direct traces or parasitic and external component types. through onboard transmission lines. For short Recommendations that optimize performance include: connections, consider the trace and the input to the next device as a lumped capacitive load. • Minimize parasitic capacitance to any ac ground Relatively wide traces (50 mils to 100 mils) should for all of the signal I/O pins. Parasitic capacitance be used, preferably with ground and power planes on the output and input pins can cause instability. opened up around them. Estimate the total To reduce unwanted capacitance, a window capacitive load and determine if isolation resistors around the signal I/O pins should be opened in all on the outputs are necessary. Low parasitic of the ground and power planes around those capacitive loads (< 4 pF) may not need an RS pins. Otherwise, ground and power planes should since the THS4500 family is nominally be unbroken elsewhere on the board. compensated to operate with a 2-pF parasitic • Minimize the distance (< 0.25”) from the load. Higher parasitic capacitive loads without an power-supply pins to high-frequency 0.1- µF RS are allowed as the signal gain increases decoupling capacitors. At the device pins, the (increasing the unloaded phase margin). If a long ground and power-plane layout should not be in trace is required, and the 6-dB signal loss intrinsic close proximity to the signal I/O pins. Avoid to a doubly-terminated transmission line is narrow power and ground traces to minimize acceptable, implement a matched impedance inductance between the pins and the decoupling transmission line using microstrip or stripline capacitors. The power-supply connections should techniques (consult an ECL design handbook for always be decoupled with these capacitors. microstrip and stripline layout techniques). Larger (6.8 µF or more) tantalum decoupling • A 50-Ω environment is normally not necessary capacitors, effective at lower frequency, should onboard, and in fact, a higher impedance also be used on the main supply pins. These may environment improves distortion as shown in the be placed somewhat farther from the device and distortion versus load plots. With a characteristic may be shared among several devices in the board trace impedance defined based on board same area of the PC board. The primary goal is to material and trace dimensions, a matching series minimize the impedance seen in the resistor into the trace from the output of the differential-current return paths. THS4500 family is used as well as a terminating • Careful selection and placement of external shunt resistor at the input of the destination components preserve the high frequency device. performance of the THS4500 family. Resistors • Remember also that the terminating impedance is should be a very low reactance type. the parallel combination of the shunt resistor and Surface-mount resistors work best and allow a the input impedance of the destination device: this tighter overall layout. Metal-film and carbon total effective impedance should be set to match composition, axially-leaded resistors can also the trace impedance. If the 6-dB attenuation of a provide good high frequency performance. Again, doubly terminated transmission line is keep their leads and PC board trace length as unacceptable, a long trace can be short as possible. Never use wirewound type series-terminated at the source end only. Treat resistors in a high-frequency application. Since the the trace as a capacitive load in this case. This output pin and inverting input pins are the most does not preserve signal integrity as well as a sensitive to parasitic capacitance, always position doubly-terminated line. If the input impedance of the feedback and series output resistors, if any, as the destination device is low, there is some signal close as possible to the inverting input pins and attenuation due to the voltage divider formed by output pins. Other network components, such as the series output into the terminating impedance. input termination resistors, should be placed close to the gain-setting resistors. Even with a low • Socketing a high speed part like the THS4500 parasitic capacitance shunting the external family is not recommended. The additional lead resistors, excessively high resistor values can length and pin-to-pin capacitance introduced by create significant time constants that can degrade the socket can create an extremely troublesome performance. Good axial metal-film or parasitic network which can make it almost surface-mount resistors have approximately impossible to achieve a smooth, stable frequency 0.2 pF in shunt with the resistor. For resistor response. Best results are obtained by soldering values > 2.0 k Ω, this parasitic capacitance can the THS4500 family parts directly onto the board. 28 Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): THS4504 THS4505 |
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