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TLV314, TLV2314, TLV4314

SBOS754A – MARCH 2016 – REVISED MARCH 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

7

V

Signal input pins

Voltage(2)

(V–) – 0.5

(V+) + 0.5

V

Current(2)

–10

10

mA

Output short-circuit(3)

Continuous

mA

Temperature

Specified, TA

–40

125

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage

Single supply

1.8

5.5

V

Dual supply

±0.9

±2.75

Specified temperature range

–40

125

°C