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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV314, TLV2314, TLV4314

SBOS754A – MARCH 2016 – REVISED MARCH 2016

TLVx314

3-MHz, Low-Power, Internal EMI Filter, RRIO, Operational Amplifier

1

1 Features

1

•

Low Offset Voltage: 0.75 mV (typ)

•

Low Input Bias Current: 1 pA (typ)

•

Wide Supply Range: 1.8 V to 5.5 V

•

Rail-to-Rail Input and Output

•

Gain Bandwidth: 3 MHz

•

Low IQ: 250 µA/Ch (max)

•

Low Noise: 16 nV/

√Hz at 1 kHz

•

Internal RF/EMI Filter

•

Extended Temperature Range:

–40°C to +125°C

2 Applications

•

White Goods

•

Handheld Test Equipment

•

Portable Blood Glucose Systems

•

Remote Sensing

•

Active Filters

•

Industrial Automation

•

Battery-Powered Electronics

EMIRR vs Frequency

3 Description

The TLV314 family of single-, dual-, and quad-

channel operational amplifiers represents a new

generation of low-power, general-purpose operational

amplifiers.

Rail-to-rail

input

and

output

swings

(RRIO), low quiescent current (150

μA typically at

5 V) combine with a wide bandwidth of 3 MHz to

make this family very attractive for a variety of

battery-powered applications that require a good

balance between cost and performance. Additionally,

the TLV314 family architecture achieves a low input

bias current of 1 pA, allowing for applications with M

Ω

source impedances.

The robust design of the TLV314 devices provides

ease-of-use to the circuit designer: unity-gain stability,

RRIO, capacitive loads of up to 300 pF, an integrated

RF/EMI rejection filter, no phase reversal in overdrive

conditions, and high electrostatic discharge (ESD)

protection (4-kV HBM).

These

devices

are

optimized

for

low-voltage

operation as low as 1.8 V (±0.9 V) and up to 5.5 V

(±2.75 V), and are specified over the extended

industrial temperature range of –40°C to +125°C.

The TLV314 (single) is available in both 5-pin SC70

and SOT-23 packages. The TLV2314 (dual) is offered

in 8-pin SOIC and VSSOP packages. The quad-

channel TLV4314 is offered in a 14-pin TSSOP

package.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TLV314

SOT-23 (5)

2.90 mm × 1.60 mm

SC70 (5)

2.00 mm × 1.25 mm

TLV2314

VSSOP (8)

3.00 mm × 3.00 mm

SOIC (8)

4.90 mm × 3.91 mm

TLV4314

TSSOP (14)

5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.