TLV9101 datasheet(11/91 Pages) TI2

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6.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

TLV9102, TLV9102S

UNIT

(SOIC)

DDF

(SOT-23-8)

DGK

(VSSOP)

DGS

(VSSOP)

DSG

(WSON)

(TSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient

thermal resistance

138.7

150.4

189.3

152.2

81.6

188.4

149.6

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

78.7

85.6

75.8

67.3

101.6

77.1

58.3

°C/W

RθJB

Junction-to-board thermal

resistance

82.2

70.0

111.0

95.5

48.3

119.1

77.7

°C/W

ψJT

Junction-to-top

characterization

parameter

27.8

8.1

15.4

67.9

6.0

14.2

1.3

°C/W

ψJB

Junction-to-board

characterization

parameter

81.4

69.6

109.3

94.3

48.3

117.4

77.5

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

22.8

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information for Quad Channel

THERMAL METRIC(1)

TLV9104, TLV9104S

UNIT

(SOIC)

(TSSOP)

RTE

(WQFN)

RUC

(WQFN)

14 PINS

16 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

105.2

134.7

53.5

143.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.2

55.0

58.3

46.4

°C/W

RθJB

Junction-to-board thermal resistance

61.1

79.0

28.6

81.8

°C/W

ψJT

Junction-to-top characterization parameter

21.4

9.2

2.1

1.0

°C/W

ψJB

Junction-to-board characterization parameter

60.7

78.1

28.6

81.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

12.6

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

TLV9101, TLV9102, TLV9104

SBOS943E – FEBRUARY 2019 – REVISED AUGUST 2021

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Product Folder Links: TLV9101 TLV9102 TLV9104

TLV9101 Datasheet(PDF) 11 Page - Texas Instruments

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