• Added "Output low voltage" for the New chip in Electrical Characteristics table................................................7

• Added "High-level output leakage current" for the New chip in Electrical Characteristics table.........................7

• Added "Quiescent current" for the New chip and all test conditions in the Electrical Characteristics table........7

• Updated the typo for fs=40KHz and changed to fs=400KHz...............................................................................7

• Removed limitation on Undervoltage lockout..................................................................................................... 7

• Added "Power-on-reset threshold" for the New chip in the Electrical Characteristics table............................... 7

• Added Brownout detect value in the Electrical Characteristics table..................................................................7

• Changed t(SUDAT) in High-Speed Mode from 10ns to 20ns for the New chip................................................ 11

• Added “Typical Characteristics (TMP411)” graphs for the New chip................................................................ 12

• Updated the Basic Connections figure in the Overview section....................................................................... 19

• Updated the Functional Block Diagram and Simplified Block Diagrams ......................................................... 20

• Updated the Undervoltage Lockout section due to Undervoltage lockout voltage removal by POR in the

New chip...........................................................................................................................................................23

• Added clarification to Shutdown Mode (SD) section to match actual silicon behavior .................................... 24

• Updated the Status Register section due to Undervoltage lockout voltage removal by POR in the New chip.33

• Added D+ waveform in the Design Requirements section............................................................................... 41

• Updated Detailed Design Procedure section....................................................................................................42

• Added Documentation Support and Related Documentation sections.............................................................46

Changes from Revision C (May 2008) to Revision D (August 2016)

Page

• Added "Offset Registers for System Calibration" and "Pin and Registers Compatible With ADT7461 and

ADM1032" to Features section ..........................................................................................................................1

• Kept VSSOP as a package option in Device Information table to match POA and eMSG information............. 1

• Changed "MSOP-8" to "VSSOP-8" throughout document ................................................................................ 1

• Added package designators to pinout images in Pin Configurations and Functions section ............................ 5

• Added Functional Block Diagram .................................................................................................................... 20

• Added Timing Diagrams section ......................................................................................................................25

• Added Power Supply Recommendations information ..................................................................................... 44

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

TMP411, TMP411D

SBOS383E – DECEMBER 2006 – REVISED JULY 2025

Copyright © 2025 Texas Instruments Incorporated

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Product Folder Links: TMP411 TMP411D