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TPA2016D2

SLOS524E – JUNE 2008 – REVISED MAY 2016

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 4

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 5

7.1

Absolute Maximum Ratings ...................................... 5

7.2

ESD Ratings.............................................................. 5

7.3

Recommended Operating Conditions ....................... 5

7.4

Thermal Information .................................................. 5

7.5

Electrical Characteristics........................................... 6

7.6

I2C Timing Requirements.......................................... 6

7.7

Dissipation Ratings ................................................... 6

7.8

Operating Characteristics.......................................... 7

7.9

Typical Characteristics .............................................. 8

8

Parameter Measurement Information ................ 11

9

Detailed Description ............................................ 12

9.1

Overview ................................................................. 12

9.2

Functional Block Diagram ....................................... 12

9.3

Feature Description................................................. 12

9.4

Device Functional Modes........................................ 21

9.5

Programming........................................................... 21

9.6

Register Maps ......................................................... 24

10

Application and Implementation........................ 29

10.1

Application Information.......................................... 29

10.2

Typical Applications .............................................. 29

11

Power Supply Recommendations ..................... 32

11.1

Power Supply Decoupling Capacitors................... 32

12

Layout................................................................... 32

12.1

Layout Guidelines ................................................. 32

12.2

Layout Examples................................................... 34

12.3

Efficiency and Thermal Considerations ................ 36

13

Device and Documentation Support ................. 37

13.1

Device Support...................................................... 37

13.2

Community Resources.......................................... 37

13.3

Trademarks ........................................................... 37

13.4

Electrostatic Discharge Caution ............................ 37

13.5

Glossary ................................................................ 37

14

Mechanical, Packaging, and Orderable

Information ........................................................... 37

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (August 2009) to Revision E

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1

Changes from Revision C (October 2008) to Revision D

Page

•

Added Feature: 2.8 W/Ch Into 4

Ω at 5 V (10% THD+N) ...................................................................................................... 1

•

Added Feature: 1.5 W/Ch Into 4

Ω at 3.6 V (10% THD+N) ................................................................................................... 1

•

Added the RTJ (QFN) pin out package .................................................................................................................................. 4

•

Changed the RTJ Package Options to the Available Options Table...................................................................................... 4

•

Changed ISWS Softwre shutdown 3.6V From: Max 60 to: 70 µA ............................................................................................ 6

•

Changed ISWS Softwre shutdown 5.5V From: Max 100 to 110 µA ......................................................................................... 6

•

Changed Output offset TYP From 0 mV To: 2 mV................................................................................................................. 6

•

Added the RTJ (QFN) package to the Dissipation Ratings Table.......................................................................................... 6

•

Deleted Table of Graphs from the Typical Characteristics..................................................................................................... 8

•

Added 4

Ω Efficiency Graph .................................................................................................................................................... 9

•

Added 4

Ω Total Power Dissipation Graph ............................................................................................................................. 9

•

Added 4

Ω Total Supply Current Graph .................................................................................................................................. 9

•

Added QFN Output Power Graph......................................................................................................................................... 10

•

Added text notes 4 and 5 to the Test Setup for Graphs....................................................................................................... 11