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LM5145 Datasheet(PDF) 64 Page - Texas Instruments |
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LM5145 Datasheet(HTML) 64 Page - Texas Instruments |
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64 / 74 page  9.2.1.2 Thermal Design Resources • White paper: – Texas Instruments, Improving Thermal Performance in High Ambient Temperature Environments With Thermally Enhanced Packaging • Applications notes: – Texas Instruments, Thermal Design by Insight, Not Hindsight – Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages – Texas Instruments, Semiconductor and IC Package Thermal Metrics – Texas Instruments, PowerPAD™ Thermally Enhanced Package – Texas Instruments, Using New Thermal Metrics • Application brief: – Texas Instruments, PowerPAD™ Made Easy 9.2.1.3 PCB Layout Resources • LM5137F-Q1-EVM12V and LM25137F-Q1-EVM5D3 Altium layout source files • Applications notes: – Texas Instruments, AN-1149 Layout Guidelines for Switching Power Supplies • Application brief: – Texas Instruments, Improve High-Current DC/DC Regulator EMI Performance for Free With Optimized Power Stage Layout • Seminar: – Texas Instruments, Constructing Your Power Supply – Layout Considerations 9.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 9.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 9.5 Trademarks PowerPAD™ and TI E2E™ are trademarks of Texas Instruments. WEBENCH® is a registered trademark of Texas Instruments. All trademarks are the property of their respective owners. 9.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 9.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. LM5137 SNVSCU3 – OCTOBER 2025 www.ti.com 64 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: LM5137 |
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