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LM5145 Datasheet(PDF) 71 Page - Texas Instruments |
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LM5145 Datasheet(HTML) 71 Page - Texas Instruments |
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71 / 74 page  A A www.ti.com PACKAGE OUTLINE 6.1 5.9 6.1 5.9 1.0 0.8 0.05 0.00 2X 4.5 28X 0.5 2X 4.5 36X 0.5 0.3 3.3 0.1 0.1 MIN 2X 1 32X 0.3 0.2 4X 0.32 0.22 2X 1 (0.2) TYP (0.13) (0.16) TYP 4X (0.17) VQFN - 1 mm max height RHA0036D PLASTIC QUAD FLATPACK - NO LEAD 4230454/A 02/2024 0.08 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PINS 3, 24, 29 & 34 PIN 1 INDEX AREA SEATING PLANE PIN 1 ID PKG EXPOSED THERMAL PAD PKG 1 9 10 17 18 26 27 36 37 0.1 C A B 0.05 C 0.1 C A B 0.05 C PINS 3, 24, 29 & 34 SCALE 2.000 A-A 30.000 SECTION A-A TYPICAL A B C |
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