4

TPS54821

SLVSB14B – OCTOBER 2011 – REVISED FEBRUARY 2016

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltage

VIN

–0.3

20

V

PVIN

–0.3

20

EN

–0.3

6

BOOT

–0.3

27

VSENSE

–0.3

3

COMP

–0.3

3

PWRGD

–0.3

6

SS/TR

–0.3

3

RT/CLK

–0.3

6

Output Voltage

BOOT-PH

0

7.5

V

PH

–1

20

PH 10ns Transient

–3

20

Vdiff (GND to exposed thermal pad)

–0.2

0.2

V

Source Current

RT/CLK

±100

µA

PH

Current Limit

A

Sink Current

PH

Current Limit

A

PVIN

Current Limit

COMP

±200

µA

PWRGD

–0.1

5

mA

Operating Junction Temperature

IOUT = 8 A

–40

125

°C

IOUT = 6 A

–40

150

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

all pins(2)

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage range

VIN

4.5

17

V

Power stage input voltage range

PVIN

1.6

17

V

Output current

TJ = –40°C to 125°C

0

8

A

Operating junction temperature, TJ

IOUT = 6 A

–40

150

°C

IOUT = 8 A

–40

125

°C