8 Device and Documentation Support

8.1 Documentation Support

8.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, High Speed Layout Guidelines

• Texas Instruments, USB 2.0 Board Design and Layout Guidelines

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (March 2017) to Revision D (August 2024)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Changed pitch dimension from 0.5mm to 0.4mm...............................................................................................1

• Changed the 480-Mbps USB 2.0 Eye Pattern for USB Switch graph. ............................................................ 14

• Changed SEL2 pin name to SEL0 in the Layout Example image to keep consistency across the data sheet 16

Changes from Revision B (December 2016) to Revision C (March 2017)

Page

• Changed Feature From: 1.8-V Compatible Control Inputs (SEL, OE) To: 1.8-V Compatible Control Inputs

(SEL)...................................................................................................................................................................1

• Changed second pin D+ To: D- in the Switch Diagram ..................................................................................... 1

• Changed DIGITAL CONTROL INPUTS (SEL, OE) To: DIGITAL CONTROL INPUTS (SEL) in the Electrical

Characteristics table........................................................................................................................................... 5

• Changed second pin D+ To: D- in the Functional Block Diagram ................................................................... 10

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TS3USB3031

SCDS348D – SEPTEMBER 2013 – REVISED AUGUST 2024

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Product Folder Links: TS3USB3031