5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (see (1) (2))

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

VIN

Control input voltage

–0.5

7

V

VI/O

Signal path I/O voltage (3)

D+, D– when VCC > 0V

–0.5

VCC + 0.3

V

D+, D– when VCC = 0V

–0.5

5.25

IIK

Control input clamp current

VIN < 0V

–50

mA

II/OK

I/O port clamp current

VI/O < 0V

–50

mA

II/O

ON-state switch current(4)

±64

mA

Continuous current through VCC or GND

±100

mA

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

VI and VO are used to denote specific conditions for VI/O.

(4)

II and IO are used to denote specific conditions for II/O.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM),

per ANSI/ESDA/JEDEC JS-001(1)

All pins

8000

V

I/O port to GND

15000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002 (2)

1000

V

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) (1).

MIN

MAX

UNIT

VCC

Supply voltage

3

4.3

V

VIH

High-level control input voltage

VCC = 3V to 3.6V

1.3

VCC

V

VCC = 4.3V

1.7

VCC

VIL

Low-level control input voltage

VCC = 3V to 3.6V

0

0.5

V

VCC = 4.3V

0

0.7

VI/O

Data input/output voltage

0

VCC

V

TA

Operating free-air temperature

–40

85

°C

(1)

All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to Implications of Slow or

Floating CMOS Inputs.

5.4 Thermal Information

THERMAL METRIC(1)

Device

UNIT

DGS (VSSOP)

RSW (UQFN)

10 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

203.1

114.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

88.7

64.7

°C/W

RθJB

Junction-to-board thermal resistance

123.0

21.0

°C/W

ψJT

Junction-to-top characterization parameter

21.2

1.9

°C/W

TS3USB30E

SCDS255G – DECEMBER 2008 – REVISED OCTOBER 2024

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