PACKAGE OPTION ADDENDUM

www.ti.com

6-Dec-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

ISO6441DWR

Active

Production

SOIC (DW) | 16

2000 | LARGE T&R

Yes

NIPDAU

Level-2-260C-1 YEAR

-40 to 125

ISO6441

XISO6440DBQR

Active

Preproduction

SSOP (DBQ) | 16

2500 | LARGE T&R

-

Call TI

Call TI

-

XISO6440DFPR

Active

Preproduction

SSOP (DFP) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

XISO6440DWR

Active

Preproduction

SOIC (DW) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

XISO6440FDBQR

Active

Preproduction

SSOP (DBQ) | 16

2500 | LARGE T&R

-

Call TI

Call TI

-

XISO6440FDFPR

Active

Preproduction

SSOP (DFP) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

XISO6440FDWR

Active

Preproduction

SOIC (DW) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

XISO6441DBQR

Active

Preproduction

SSOP (DBQ) | 16

2500 | LARGE T&R

-

Call TI

Call TI

-40 to 125

XISO6441DFPR

Active

Preproduction

SSOP (DFP) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-40 to 125

XISO6441FDBQR

Active

Preproduction

SSOP (DBQ) | 16

2500 | LARGE T&R

-

Call TI

Call TI

-40 to 125

XISO6441FDFPR

Active

Preproduction

SSOP (DFP) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-40 to 125

XISO6442DBQR

Active

Preproduction

SSOP (DBQ) | 16

2500 | LARGE T&R

-

Call TI

Call TI

-

XISO6442DFPR

Active

Preproduction

SSOP (DFP) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-40 to 125

XISO6442DWR

Active

Preproduction

SOIC (DW) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

XISO6442FDBQR

Active

Preproduction

SSOP (DBQ) | 16

2500 | LARGE T&R

-

Call TI

Call TI

-

XISO6442FDFPR

Active

Preproduction

SSOP (DFP) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

XISO6442FDWR

Active

Preproduction

SOIC (DW) | 16

2000 | LARGE T&R

-

Call TI

Call TI

-

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

Addendum-Page 1