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WILCS02 Datasheet(PDF) 19 Page - Microchip Technology

Part # WILCS02
Description  single chip 2.4 GHz and IEEE 802.11b/g/n-compliant solution
PDF  71 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

WILCS02 Datasheet(HTML) 19 Page - Microchip Technology

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WILCS02IC and WILCS02 Family
Device Overview
 Data Sheet
© 2024-2025 Microchip Technology Inc. and its subsidiaries
DS70005557C - 19
Figure 2-11. WILCS02 Module Placement
Related Links
WILCS02 Module Packaging Information
2.5
WILCS02 Module Routing Guidelines
• Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
• The top layer (underneath the module) of the host board must be ground with as many GND vias
as possible, as illustrated in the following figure.
• Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the
edge of the WILCS02 Module.
• For a better GND connection to the WILCS02 Module, solder the exposed GND pads of the
WILCS02 Module on the host board.
• For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to
all the layers and thermal conduction path.
• Having a series resistor on the host board for all reserved pins and digital interface pins is
recommended. These resistors must be placed close to the WILCS02 Module.



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