Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

Preview PDF HTML

WILCS02 Datasheet(PDF) 54 Page - Microchip Technology

Part # WILCS02
Description  single chip 2.4 GHz and IEEE 802.11b/g/n-compliant solution
PDF  71 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

WILCS02 Datasheet(HTML) 54 Page - Microchip Technology

Back Button WILCS02 Datasheet HTML 50Page - Microchip Technology WILCS02 Datasheet HTML 51Page - Microchip Technology WILCS02 Datasheet HTML 52Page - Microchip Technology WILCS02 Datasheet HTML 53Page - Microchip Technology WILCS02 Datasheet HTML 54Page - Microchip Technology WILCS02 Datasheet HTML 55Page - Microchip Technology WILCS02 Datasheet HTML 56Page - Microchip Technology WILCS02 Datasheet HTML 57Page - Microchip Technology WILCS02 Datasheet HTML 58Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 54 / 71 page
background image
WILCS02IC and WILCS02 Family
Packaging Information
 Data Sheet
© 2024-2025 Microchip Technology Inc. and its subsidiaries
DS70005557C - 54
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
5.40
5.40
MILLIMETERS
0.50 BSC
MIN
E
MAX
6.90
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.85
0.30
NOM
C1
Contact Pad Spacing
6.90
Contact Pad to Contact Pad (X44)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2021 Microchip Technology Inc.
Contact Pad to Center Pad (X48)
G1
0.33
C1
C2
EV
EV
X2
Y2
E
X1
Y1
G1
G2
ØV
SILK SCREEN
48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN]
With 5.3 mm Exposed Pad
Microchip Technology Drawing C04-2535 Rev A



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com