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MPF0900AMBA2ES Datasheet(PDF) 202 Page - NXP Semiconductors

Part # MPF0900AMBA2ES
Description  Nine-channel power management IC with advanced system safety monitoring
PDF  205 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPF0900AMBA2ES Datasheet(HTML) 202 Page - NXP Semiconductors

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NXP Semiconductors
PF09
Nine-channel power management IC with advanced system safety monitoring
Tab. 206. FCCUx debounce time configuration bit ........157
Tab. 207. FCCUx reaction configuration bit .................. 158
Tab. 208. FCCUx internal pull resistor selection bits .....158
Tab. 209. Fault detection in bistable mode ................... 159
Tab. 210. Pull resistor configuration in bistable mode ... 159
Tab. 211. FCCUx fault detection in single-ended
mode ..............................................................161
Tab. 212. Pull resistor selection in single-ended level
monitoring ......................................................161
Tab. 213. FCCUx error conditions .................................162
Tab. 214. FCCUx internal pull resistor selection in
single-ended PWM mode ..............................162
Tab. 215. FCCUx sense bit ...........................................162
Tab. 216. FCCU0 sense bit ...........................................162
Tab. 217. FCCU electrical characteristics ..................... 162
Tab. 218. ABIST flags ................................................... 163
Tab. 219. LBIST status bits ...........................................165
Tab. 220. SHS faults to assert RSTB ............................170
Tab. 221. SHS faults to power cutoff ............................ 170
Tab. 222. BGMON RSTB debounce time to assert
RSTB via the DMS ........................................170
Tab. 223. BGMON debounce time to enable the
power cutoff via the DMS ..............................171
Tab. 224. VDIG_OV debounce time to assert RSTB
via the DMS .................................................. 171
Tab. 225. VDIG_OV debounce time to enable the
power cutoff via the DMS ..............................171
Tab. 226. DMS electrical characteristics ....................... 172
Tab. 227. I2C register reset conditions ......................... 173
Tab. 228. I2C bit type definitions ...................................173
Tab. 229. Functional register map .................................173
Tab. 230. Bits reset during soft reset. ........................... 180
Tab. 231. OTP register color code ................................ 182
Tab. 232. OTP Register Map ........................................ 182
Tab. 233. ESD Ratings ..................................................187
Tab. 234. Thermal characteristics ................................. 188
Tab. 235. QFN56 thermal resistance package
dissipation ratings ..........................................188
Tab. 236. Operating conditions ..................................... 189
Tab. 237. Revision history .............................................196
PF09
All information provided in this document is subject to legal disclaimers.
© 2026 NXP B.V. All rights reserved.
Product data sheet
Rev. 1.3 — 16 December 2025
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