8 Device and Documentation Support

8.1 Documentation Support

8.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, EMI rejection ratio of operational amplifiers application note

• Texas Instruments, QFN/SON PCB attachment application note

• Texas Instruments, Quad flatpack no-lead logic packages application note

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

Trademarks

Excel™ is a trademark of Microsoft Coproration.

TI E2E™ is a trademark of Texas Instruments.

Bluetooth® is a registered trademark of Bluetooth SIG, Inc.

All trademarks are the property of their respective owners.

8.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.5 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (December 2025) to Revision A (March 2026)

Page

• Changed the status of the DBV (SOT-23, 5) TLV9041D from preview to active ............................................... 1

• Changed ESD CDM model from specification JESD22-C101 to JS-002........................................................... 5

• Changed maximum input bias current from ±12pA to ±3pA...............................................................................7

• Updated maximum quiescent current of TLV9041D from 21uA to 21.4uA.........................................................7

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

TLV9041D, TLV9042D

SLVSK32A – DECEMBER 2025 – REVISED MARCH 2026

Copyright © 2026 Texas Instruments Incorporated

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Product Folder Links: TLV9041D TLV9042D